SPlSinic-Tek [Model: S8080]

High-precision 3D solder paste inspection equipment specifically designed for high-precision SMT applications, with a positioning repeatability of ≤1 μm, rapid 5-minute programming, and support for intelligent closed-loop control.

AOI HOLLY [Model: LX520iL]

Employing DISP dynamic tiling seamless mosaicking technology combined with GPU parallel computing, the system achieves a maximum inspection speed of 120 cm²/s and supports real-time full-panel image display, significantly enhancing inspection efficiency.

Artificial Intelligence – Shiyuan AOI [Model: S1-1020]

By deeply integrating deep learning algorithms, the false alarm rate is reduced by 50% to 70% compared with traditional AOI systems. Continuous self-learning capabilities further optimize the detection model, striking a balance between high accuracy and low false alarms.

3D X-Ray [Model: GE]

An industrial X-ray inspection system supporting both microfocus and nanofocus modes, with detail resolution as high as 0.2–0.5 microns and a maximum magnification exceeding 23,000×, enabling high-precision 2D/3D nondestructive inspection of BGA assemblies, solder joints, and internal structures.

Selective Wave Soldering Machine [Model: ZSWHPS-12L]

Fully automatic selective wave soldering system, with positioning accuracy of ±0.15 mm and a worktable travel of 510 × 510 mm, reducing flux consumption by 50%–70% and minimizing solder dross by more than 80%.

SMT Intelligent First Article Inspection Machine [Model: Blue Eye]

LanYan Intelligent’s first-piece inspection machine delivers 0.05% accuracy, boosts efficiency by 50%–90%, and reduces the false-positive rate to near zero.