Contact Address: 2nd Floor, Building B1, Fuyuan Industrial Zone, Tangwei, Fengtang Avenue No. 600, Bao’an District, Shenzhen
![AOI HOLLY [Model: LX520iL]](/npublic/img/s.png "AOI HOLLY [Model: LX520iL]")
AOI HOLLY [Model: LX520iL]
Employing DISP dynamic tiling seamless mosaicking technology combined with GPU parallel computing, the system achieves a maximum inspection speed of 120 cm²/s and supports real-time full-panel image display, significantly enhancing inspection efficiency.
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Capability Item | Explanation |
|---|---|
Test Content | Missing components, component shift, component tilt, tombstoning, reverse polarity, incorrect components, bridging, cold solder joints, insufficient solder, excessive solder, solder balls, and other defects—covering the entire pre- and post-reflow process. |
Minimum detection capability | Supports inspection of 01005 microchip components and ICs with a 0.3 mm pin pitch. |
Applicable Process | Applicable to both leaded and lead-free processes, before and after reflow ovens, after wave soldering, and after solder paste printing. |
Hardware Specifications | PCB size: 50×50 mm ~ 520×480 mm, thickness 0.3 ~ 4 mm, with optional multi-resolution settings of 13/16/19 μm, and a travel speed of 830 mm/s. |
Core Technology | DISP dynamic image tiling seamless mosaicking technology combined with GPU parallel computing enables real-time display of the entire image panel, significantly boosting processing efficiency. |
Intelligence and Connectivity | Supports optional features such as SPC server, offline programming, and barcode recognition; complies with the SMEMA communication standard and can be integrated with MES systems. |
Keywords:
Lichuang Tongda
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2nd and 3rd Floors, Building B1, Fuyuan Industrial Zone, Fengtang Avenue, Tangwei Community, Fuhai Subdistrict, Bao’an District, Shenzhen
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