Contact Address: 2nd Floor, Building B1, Fuyuan Industrial Zone, Tangwei, Fengtang Avenue No. 600, Bao’an District, Shenzhen
One-stop intelligent manufacturing service capability
One-stop smart manufacturing services
7000
㎡
Date of Establishment
8+2+1
Production line
98%
+
Customer satisfaction
34
+
Software Copyright
200
+
Supply chain partners
600
+
Partner Clients
Manufacturing base
Relying on a professional PCBA manufacturing base, we have a 7,000㎡ modern standardized production facility equipped with multiple high-speed and high-precision SMT lines and intelligent post-solder assembly lines. A Class 100,000 clean production environment and a standardized warehousing and logistics system have been established, enabling full-chain manufacturing capabilities from quick-turn sample prototyping, small-batch trial production to large-scale mass production.
In terms of quality control, the company has built a closed-loop quality management system across the entire process. Through the MES (Manufacturing Execution System), we achieve full-process data traceability, process controllability, and accountability from material incoming to finished product outgoing. We are equipped with high-end inspection equipment such as AI intelligent AOI inspection, 3D X-Ray solder joint inspection, SPI, etc., complemented by strict IQC (incoming quality control), IPQC (in-process quality control), and OQC (outgoing quality control) inspections, ensuring comprehensive reliability, consistency, and long-term stability of PCBA products.
Corporate Honors and Authoritative Qualifications
Manufacturing Capability
One-stopSmart ManufacturingService Capability
We offer end-to-end, one-stop smart manufacturing services spanning “CAD design — PCB fabrication — component procurement — PCBA assembly — testing — three-proofing — final assembly,” with high-precision processes, comprehensive quality control across the entire supply chain, and rapid delivery capabilities, thereby meeting the high-reliability, custom hardware requirements of multiple industries.
Layout Design Services
PCB Design Service
Scope of Services
Schematic design, PCB layout, high-speed/HDI/analog-digital mixed-signal design, and simulation optimization
Design Capability
Up to 40 layers, minimum trace width of 2.5/3 mil, supports 77 GHz/35 Gbps
Design Tools
Compatible with mainstream EDA tools such as Cadence, Altium, and Mentor PADS.
Application Fields
Compatible with high-precision products such as industrial control, medical, automotive radar, and server applications.
PCB and Component Procurement Services
PCB and Component Procurement Services
PCB manufacturing process
Layers 1–40, HDI, FPC/rigid-flex boards, supporting high-frequency, high-speed substrates.
Surface Treatment
All processes, including immersion gold, hot air solder leveling, OSP, immersion tin, and thick gold plating
Material channels
Covering more than 100 authorized channels worldwide to ensure rapid BOM completion and stable delivery.
Quality Control
Strict IQC inspection, full traceability of materials, and stable delivery schedules.
PCBA Manufacturing Services
PCBA Assembly & Testing
Process technology
SMT/DIP, reflow/solder wave soldering, board separation, cleaning, and conformal coating
Mounting accuracy
Supports 01005 components, with a minimum BGA pitch of 0.2 mm and positioning accuracy of ±0.02 mm.
Testing System
Full-process quality inspection covering SPI, AOI, X-ray, first-article inspection, functional testing, and aging tests.
Delivery capability
7 SMT lines and 3 DIP lines; prototype production: 2–3 days; small-batch production: 5–7 days.
Testing Capability · QUALITY INSPECTION
Quality Control"Zero" defects, comprehensive process control
Establish an integrated quality management system that spans material qualification, process control, multi-dimensional inspection, and end-to-end traceability. Leveraging standardized processes, intelligent systems, and rigorous testing, this system provides comprehensive coverage across the entire production value chain, steadily advancing the goal of zero defects in quality control and ensuring stable, controllable operations and reliable, traceable product quality throughout the entire process.
Comprehensive Inspection | Safeguarding Finished Product Quality
✅ Five Major System Certifications ✅ Full-Process Traceability via MES ✅ Unique Batch Identification ✅ End-to-End Material Traceability ✅ Closed-Loop Handling of Exceptions ✅ Unified Quality Standards
Closed-loop process | Ensuring production stability
✅ PFMEA risk prevention in advance ✅ IPQC full-node inspection ✅ High-precision component placement ✅ Nitrogen reflow soldering ✅ Selective wave soldering ✅ Dust-free production environment
Comprehensive Inspection | Safeguarding Finished Product Quality
✅ SPI solder paste inspection ✅ Pre- and post-reflow AOI ✅ 3D X-ray inspection ✅ Smart first-article inspection ✅ High- and low-temperature aging tests ✅ OQA outgoing inspection
End-to-End Traceability | Achieving Controllable Quality
✅ Five Major System Certifications ✅ Full-Process Traceability via MES ✅ Unique Batch Identification ✅ End-to-End Material Traceability ✅ Closed-Loop Handling of Exceptions ✅ Unified Quality Standards
Delivery Process
Phase 1: Requirements Alignment
- Customer submits product requirements; one-on-one communication.
- Clearly define application scenarios, electrical/material/production feasibility, and conduct cost analysis.
- Output the preliminary hardware solution framework
Phase 2: Product Analysis
- Architecture / Hardware / Software Design Planning
- Simulation testing, device analysis, and test scheme analysis
- Selection of the main chip and proactive identification of long-lead-time components
- Output Plan Risk Identification Checklist
Phase 3: Design and Manufacturing
- PCB Layout Design
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PCB manufacturing
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SMT chip mounting
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DIP plugin
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Testing, assembly, and three-proofing (as required)
Phase 4: Procurement and Material Preparation
- Output the complete BOM list
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Multi-channel supply assurance (OEM / distributors / traders / e-commerce)
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The WMS system enables integrated management of material receipt, inspection, and preparation.
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Secure long-lead-time materials in advance to ensure on-time, complete delivery.
Phase 5: Inspection and Testing
- SPI solder paste inspection, full-line pre- and post-reflow AOI inspection
- 3D X-ray Inspection (BGA Solder Joint Reliability)
- Smart first-article inspection, functional testing, and high-temperature aging (as required)
- Fully traceable automated test report generation
Phase 6: Delivery
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PCBA prototypes: 2–3 days; small-batch production: 10–15 days.
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From concept design to full PCBA package delivery in as little as 30 days.
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Issue a comprehensive quality report to support material traceability.
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Ongoing after-sales follow-up and support
Contact phone number:
Contact email:
Contact Address:
2nd and 3rd Floors, Building B1, Fuyuan Industrial Zone, Fengtang Avenue, Tangwei Community, Fuhai Subdistrict, Bao’an District, Shenzhen
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