3D X-Ray [Model: GE]

Capability Item

Explanation

Test Content

BGA Voiding, welding defects, cracks, bubbles, gold wire breaks, poor via fill, internal structural anomalies, and more—supported. 2D/3D Nondestructive Testing

Core Technology

Open-type microfocus / Focus on the News X X-ray tube, supported 2D Real-time imaging and 3D CT Scan, equipped with 5 Axial sample manipulation system, enabling multi-angle inspection.

Detection accuracy

Detail resolution can reach <0.2~0.5 Microns (nano-focus), with the highest geometric magnification. 2130× , total magnification exceeds 23,000 ×

Hardware Specifications

Maximum Voltage 160~240 kV Optional, maximum power 15~20W , maximum detection range 410×410mm , maximum workpiece weight 5–10 kg

Software and Operation

phoenix x
act base / 3d
arv Software that supports both manual and automatic inspection, features intuitive programming, and can generate first-article inspection reports.

Applicable Fields

Semiconductor packaging, Printed Circuit Board Assembly, automotive electronics, aerospace, consumer electronics, defense industry, and scientific research & testing